Cleaning procedures are essential steps in semiconductor processing. These are mostly used to remove particles and oxidize organic contaminants. Two of the most common clean chemistries are SC1 (H2O2/NH4OH) and SC2 (H2O2/HCL).
As these chemicals need to be spiked in order to maintain concentrations and monitored to avoid excursions , real time monitoring is needed. Both the WS201 and WS200 provide excellent monitoring solutions for these chemistries.