Rapid Thermal Processing is a common process step in semiconductor device fabrication. It involves heating a wafer up to temperatures as high as 1200C or more within a few seconds, sometimes less. In order to avoid overheating the wafer, exceeding the thermal budget or not hitting a high enough temperature point for the process, temperature control is critical. In order to achieve good temperature control, fast and accurate temperature measurement is essential.
Rapid thermal process steps include both anneal and deposition: